High Frequency Printed Circuit Board Copper Multilayer PCB With Peelable Soldermask XCEM manufacturer from China Shenzhen Xinchenger Electronic Co.,Ltd

High Frequency Printed Circuit Board Copper Multilayer PCB With Peelable Soldermask

Place of Origin:

Zhejiang, China (Mainland)


	Add to My Favorites
HiSupplier Escrow	Share \|

Product Detail

Model No.: XCEM

Printed Circuit Board High Frequency Multilayer PCB Copper With Peelable Soldermask

<stron

Printed Circuit Board High Frequency Multilayer PCB Copper With Peelable Soldermask

Specification:

Board size: 6*6 cm

Layer: 4

Model: XCEH

Board thickness: 1.8mm

Copper foil: 35UM

Material: Rogers

Parameter:

Annual stock meterial			Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No.			1-16
Min board thickness			2 layer 0.2mm
			4 layer 0.4mm
			6 layer 0.6mm
			8 layer 0.8mm
			10 layer 1.0mm
Max panel size			508*610mm
Board thickness toleranceT≥0.8mm±8%,T0.8mm±5%
Wall hole copper thickness			0.025mm(1mil)
Finished hole			0.2mm-6.3mm
Min line width			4mil/4mil(0.1/0.1mm)
Min bonding pad space			0.1mm(4mil)
PTH aperture tolerance			±0.075mm(3mil)

NPTH aperture tolerance			±0.05mm(2mil)
Hole site deviation			±0.05mm(2mil)
Profile tolerance			±0.10mm(4mil)
Board bend&warp			≤0.7%
Insulation resistance			1012Ωnormal
Through-hole resistance			300Ωnormal

We equipped with advance Processing Equipments and Measurement Techniques, such as: High Pecision CNC Drilling Machines, AOI Tester, German Flying Probe Testers and other advanced equipments, and High Frequency Board manufacturing, Special Impedance Control, Buried & Blind Via manufacturing, Flying Probe Test techniques.