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Shenzhen Xinchenger Electronic Co.,Ltd
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Gold Index: 8393
High Frequency Rogers RO3210 RF PCB Circuit Boards 0.025 Inch Thickness Fabricator
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
Rogers RO3210 RF PCB Circuit Boards 0.025inch Thickness Fabricator
Rogers RO3210 RF PCB Circuit Boards 0.025inch Thickness Fabricator
Introduction:
RF is Radio Frequency, referring to the radio, a high-frequency signal. Look for board performance requirements, can be an ordinary FR4 epoxy glass fiber ,also be Teflon and other special microwave substrates.
RF board standards:
1, low-power RF PCB design, the main use of standard FR4 material (good insulation characteristics , uniform material, a dielectric constant ε = 4,10%).
2, RF of the PCB, the individual elements should be tight arrangement, to ensure that the shortest connection between the various elements.
3, for a PCB mixed-signal, RF and analog section should stay away from digital digital part (this distance is usually more than 2cm, at least 1cm), the digital part of the ground should be separated from the RF part.
4, the choice of working environment in the high frequency components, as far as possible the use of surface-mount devices. This is because the surface-mount components are generally small, the pin element is very short.
Technology:
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Material |
FR4(standard) |
Isola / Nanya / ITEQ |
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FR4(Hi-Tg) |
Isola / Nanya / ITEQ |
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Rogers |
RO4003 /4350 /3010 /RT Duroid 5880 / 5870 |
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Arlon |
Diclad 25N / 25FR / 870 / 880 |
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Taconic |
TLY / TLC / RF35 / RF30 |
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GETEK |
RG200D / ML200D |
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Aluminum PCBs |
Di-electric materials : FR4 / Bergquist / Rogers / Thermagon |
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Copper weight |
1 ~ 5 oz internal & external layers |
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Drilling |
Min. Drilled Hole Size |
10 mil ( 6 ~ 8 mil finished) |
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Annular Ring |
5 mil(normal) / 4 mil (for Laser vias) |
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Registration |
± 3 mil |
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Max. Aspect Ratio |
10 :1 |
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Hole Size Tolerance |
+/- 3 mils (PTH) ; +/- 2 mils (N-PTH) |
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Hole Roughness |
< 0.8 mil |
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Min. Cu Plating in Holes |
> 0.8mil, Ave. 1 mil |
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Laser drill |
available |
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Image Transfer |
Min. Trace and space |
4 / 4 mil |
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SMT / BGA.Pitch |
10 mils for SMT / 30 mils for BGA |
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Trace/space Tolerance |
± 20% (or +/- 10% per IPC class 3) |
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Solder Mask |
LPI Solder Mask |
Green(glossy or matte), Blue, Red, Black, Yellow |
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Via Plugging |
min. 80% filled |
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Solder Mask ink |
Taiyo & Tamura |
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Registration |
± 2 mil |
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Min Solder Dam |
2.5 mil |
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Thickness |
0.5 ~1.5 mil |
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Silkscreen |
White, Yellow, Black |
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Min. silkscreen width |
8 mil |
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CNC Dimension |
± 5 mil |
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Punch Dimension |
± 4 mil |
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Blind Vias / Buried Vias |
Yes |
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VIP (Via in Pad) |
Yes (Non-conductive epoxy resin-filled or Cu filled) |
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Impedance control |
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± 10% |
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Surface Finish |
HASL |
200 ~ 500 μ" |
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Shenzhen Xinchenger Electronic Co.,Ltd [China (Mainland)]
Business Type:Manufacturer | ||
