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Shenzhen Xinchenger Electronic Co.,Ltd
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Gold Index: 8393
Taconic 6 Layer High Frequency PCB HF Custom Printed Circuit Boards Manufacturing Process
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
Taconic 6 Layer High Frequancy PCB HF Printed Circuit Boards
Specification:<
Taconic 6 Layer High Frequancy PCB HF Printed Circuit Boards
Specification:
|
Materia raw |
Taconic TLY-5 |
Board THK |
0.6mm |
|
Layer |
6 |
Solder mask |
white |
|
Surface finish |
ENIG |
Line space |
0.1mm |
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Copper THK |
1OZ |
Line width |
0.1mm |
Advantage:
OEM/ODM services are welcome
Heavy copper PCB, Heavy gold PCB, Blind & Buried PCB Board, FPC Flex-Rigid,HDI PCB, Impedance
control panel High layer count PCB, are available.
Factory direct wholesale price
Replying with price within 1 hour
Shipping within 24 hours
Certificate: ROHS, UL,SGS,9001-2000, ISO14001, SGS Lead-Free
Parameter
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XCE PCB technical specifications |
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Material |
Taconic TLY-5 |
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Layer No. |
6 |
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Min board thickness |
2 layer0.2mm 4 layer0.4mm 6 layer 0.6mm 8 layer 0.8mm 10 layer 1.0mm |
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Max panel size |
508*610mm |
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Board thickness tolerance |
T≥0.8mm±8%.,T<0.8mm±5% |
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Wall hole copper thickness |
>0.025mm(1mil) |
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Finished hole |
0.2mm-6.3mm |
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Min line width |
4mil/4mil(0.1/0.1mm) |
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Min bonding pad space |
0.1mm(4mil) |
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PTH aperture tolerance |
±0.075mm(3mil) |
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NPTH aperture tolerance |
±0.05mm(2mil) |
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Hole site deviation |
±0.05mm(2mil) |
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Profile tolerance |
±0.10mm(4mil) |
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Board bend&warp |
≤0.7% |
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Insulation resistance |
>1012Ωnormal |
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Through-hole resistance |
<300Ωnormal |
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Electric strength |
>1.3kv/mm |
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Current breakdown |
10A |
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Peel strength |
1.4N/mm |
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Soldmask regidity |
>6H |
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Thermal stress |
28820Sec |
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Testing voltage |
50-300V |
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Min buried blind via |
0.2mm(8mil) |
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Outer copper thickness |
1oz-5oz |
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Inner cooper thickness |
1/2 oz-4oz |
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Aspect ratio |
8:1 |
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SMT min green oil width |
0.08mm |
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Min green oil open window |
0.05mm |
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Insulation layer thickless |
0.075mm-5mm |
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Taphole aperture |
0.2mm-0.6mm |
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Special technology |
Indepedance,Blind buried via,thick gold,aluminum PCB |
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Surface finish |
HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating |
Application:
Mobile communication products, amplifier, low noise amplifier,GSM, CDMA,
3G smart antenna,splitters, diplexers, filters, couplers and other passive components
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Company Info
Shenzhen Xinchenger Electronic Co.,Ltd [China (Mainland)]
Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)
