2+6+2 Stack Up Impedance HDI Multi Layer PCB FR4 Board With Rogers Mixed Compression XCEM manufacturer from China Shenzhen Xinchenger Electronic Co.,Ltd

2+6+2 Stack Up Impedance HDI Multi Layer PCB FR4 Board With Rogers Mixed Compression

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: XCEM

2+6+2 Stack Up Impedance HDI Multilayer PCB FR4 With Rogers Mixed Compression

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2+6+2 Stack Up Impedance HDI Multilayer PCB FR4 With Rogers Mixed Compression

Specification:

Type: 2+6+2 Stack up Impedance HDI
Material:
Layer Count: 10
Finish Thickness: 1.2+8%mm
Min. Via dia: 0.2mm
Surface Finish: ENIG+Hard Gold Plating
Specialty:
L1-2, L2-3, L8-9, L9-10: Resin fill, laser blind via of 0.1mm; L3-8: Buried via and resin filled.

Parameter:

PCB parameter
Max panel size			508*610mm
Board thickness tolerance			T≥0.8mm±8%,T0.8mm±5%
Wall hole copper thickness			0.025mm(1mil)
Finished hole			0.2mm-6.3mm
Min line width			4mil/4mil(0.1/0.1mm)
Min bonding pad space			0.1mm(4mil)
PTH aperture tolerance			±0.075mm(3mil)
NPTH aperture tolerance			±0.05mm(2mil)
Hole site deviation			±0.05mm(2mil)
Profile tolerance			±0.10mm(4mil)
Board bend&warp			≤0.7%
Insulation resistance			1012Ωnormal
Through-hole resistance			300Ωnormal
Electric strength			1.3kv/mm
Current breakdown			10A
Peel strength			1.4N/mm
Soldmask regidity			6H
Thermal stress			28820Sec
Testing voltage			50-300v
Min buried blind via			0.2mm(8mil)
Outer cooper thickness			1oz-5oz
Inner cooper thickness			1/2 oz-4oz
Aspect ratio			8:1
SMT min green oil width			0.08mm
Min green oil open window			0.05mm
Insulation layer thickness			0.075mm-5mm
Aperture			0.2mm-0.6mm
Special technology			Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish			HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating