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High Speed RF PCB Material Electronic Circuit Boards Double Layer Eco-friendly 

Place of Origin: Zhejiang, China (Mainland) 
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Product Detail

Model No.: XCEH

Advanced High Speed RF PCB Material Electronic Circuit Boards 
 
 
Specification:

Advanced High Speed RF PCB Material Electronic Circuit Boards 

 

 

Specification:

 

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency).

 

 

These frequency ranges are used for communication signals in everything from cellphones to military radars.  The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials.  These materials can be mixed in the same Stack-Up for optimal performance and economics.

 

 

 

Features

 

  • CTEr = +40/+50 ppm per °C (low); Tg (glass transition temperature) is 280°C
  • ER = 3.38/3.48 at 10.0 GHz
  • ER is constant to 40.0 GHz
  • ED (electro-deposited) copper only
  • Layer-to-layer thickness control = +/- 0.001
  • Fabrication costs are typical to slightly increased

 

Parameter:

 

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size:  (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:  ±0.13
13 Hole tolerance:  PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling

 

 

 

 

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Company Info

Shenzhen Xinchenger Electronic Co.,Ltd [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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