Base material

Rogers4003C

Board THK

1.8mm

Layer

2

Board size

10*8cm

Surface finish

HASL lead free

Line space

3mil

Copper THK

3OZ

Line width

3 mil

Board thickness tolerance

T≥0.8mm±8%,T0.8mm±5%

Wall hole copper thickness

0.025mm(1mil)

Finished hole

0.2mm-6.3mm

Min line width

4mil/4mil(0.1/0.1mm)

Min bonding pad space

10mil

PTH aperture tolerance

10mil

NPTH aperture tolerance

10mil

Hole site deviation

10mil

Profile tolerance

±0.10mm

Board bend&warp

≤0.7%

Insulation resistance

1012Ωnormal

Through-hole resistance

300Ωnormal

Electric strength

1.3kv/mm

Current breakdown

10A

Peel strength

1.4N/mm

Soldmask regidity

6H

Thermal stress

28820Sec

Testing voltage

50-300v

Min buried blind via

N/O

Outer cooper thickness

3oz

Inner cooper thickness

3oz

Aspect ratio

8:1

SMT min green oil width

0.08mm

Min green oil open window

0.05mm

Insulation layer thickness

0.075mm-5mm

Aperture

0.2mm-0.6mm