Electronic FR4 PCBA / PCB Board Assembly Service 2 Layer Single Sided or Double-sided XCEA manufacturer from China Shenzhen Xinchenger Electronic Co.,Ltd

Electronic FR4 PCBA / PCB Board Assembly Service 2 Layer Single Sided or Double-sided

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: XCEA

High Quality Electronics Products PCB / PCBA Assembly Service

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High Quality Electronics Products PCB / PCBA Assembly Service

NO	Item	Craft Capacity
1	Layer	1-30 Layers
2	Base Material for PCB	FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material
3	Rang of finish baords Thickness	0.21-7.0mm
4	Max size of finish board	900MM*900MM
5	Minimum Linewidth	3mil (0.075mm)
6	Minimum Line space	3mil (0.075mm)
7	Min space between pad to pad	3mil (0.075mm)
8	Minimum hole diameter	0.10 mm
9	Min bonding pad diameter	10mil
10	Max proportion of drilling hole and board thickness	1:12.5
11	Minimum linewidth of Idents	4mil
12	Min Height of Idents	25mil
13	Finishing Treatment	HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.
14	Soldermask	Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask.
15	Minimun thickness of soldermask	10um
16	Color of silk-screen	White, Black, Yellow ect.
17	E-Testing	100% E-Testing (High Voltage Testing); Flying Probe Testing
18	Other test	ImpedanceTesting,Resistance Testing, Microsection etc.,
19	Date file format	GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++
20	Special technological requirement	Blind & Buried Vias and High Thickness copper
21	Thickness of Copper	0.5-14oz (18-490um)

Product type:

Single-sided, double-sided and multilayer printed circuit boards (PCB), flexible (soft) of circuit boards, blind buried plate.
Max size: single-sided, double-sided: 1000mm * 600mm MLB: 600mm * 600mm
Highest Number of floors: 20 floors
Processing board thickness: 0.4mm -4.0mm rigid plate flexible plate 0.025mm --- 0.15mm
Copper foil substrate thickness: rigid plate 18μ (1 / 2OZ), 35μ (1OZ), 70μ (2OZ) flexible board 0.009MM 0.018mm 0.035mm 0.070mm 0.010mm
Common substrates: FR-4, CEM-3, CEM-1, 94HB, 94VO, poly vinyl chloride, polyester, polyimide ammonium.

Process Capability:

(1) Drilling: Minimum aperture 0.15MM
(2) metal hole: Minimum aperture 0.15mm, thickness / aperture ratio of 4: 1
(3) wire width: Minimum width: gold plate 0.075mm, 0.10mm tin plate
(4) lead spacing: Minimum spacing: gold plate 0.075mm, 0.10mm tin plate
(5) gold plate: Ni layer thickness:> or = 2.5μ gold layer thickness: 0.05-0.1μm or according to customer requirements
(6) HASL: tin layer thickness:> or = 2.5-5μ
(7) paneling: Wire-to-edge minimum distance: 0.15mm hole to edge minimu