Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB XCER-1 manufacturer from China Shenzhen Xinchenger Electronic Co.,Ltd

Multi-layer HF Rogers PCB Sufficient Material for Automotive Device 1OZ Double Layer PCB

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: XCER-1

Multi-layer HF Rogers PCB Sufficient Material In Automotive Device Application

Specification</str

Multi-layer HF Rogers PCB Sufficient Material In Automotive Device Application

Specification

2 layer
Green solder mask,
white silk screen
Model:XCER
Size: 15*9cm
Location: Shenzhen
Board thickness: 0.2mm
Copper thickness: 1OZ

Laminates:

High Tg, BT resins
Low Dk, Low Df Formulations
High Strength, Low CTE selections
Polyimide/Kapton
Multi-function FR-4
Min Cladding 1 oz
Max Cladding 2 oz
Min Thickness .03mm (.0012)

Parameter

Board thickness tolerance			T≥0.8mm±8%,T0.8mm±5%
Wall hole copper thickness			0.025mm(1mil)
Finished hole			0.2mm-6.3mm
Min line width			4mil/4mil(0.1/0.1mm)
Min bonding pad space			0.1mm(4mil)
PTH aperture tolerance			±0.075mm(3mil)
NPTH aperture tolerance			±0.05mm(2mil)
Hole site deviation			±0.05mm(2mil)
Profile tolerance			±0.10mm(4mil)
Board bend&warp			≤0.7%
Insulation resistance			1012Ωnormal
Through-hole resistance			300Ωnormal
Electric strength			1.3kv/mm
Current breakdown			10A
Peel strength			1.4N/mm
Soldmask regidity			6H
Thermal stress			28820Sec
Testing voltage			50-300v
Min buried blind via			0.2mm(8mil)
Outer cooper thickness			1oz-5oz
Inner cooper thickness			1/2 oz-4oz
Aspect ratio			8:1
SMT min green oil width			0.08mm
Min green oil open window			0.05mm
Insulation layer thickness			0.075mm-5mm
Aperture			0.2mm-0.6mm
Special technology			Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish			HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

Advantage:

Newest PCB machine and top technology,professional engineer team

Shorter PCB manufacturing lead times and improved device performance for Flip Chip, BGA, MCM, SIP technologies and medical devices.

Accept utilization of technologies that require ultra thin cores, fine line geometries and alternative via technologies for enhanced thermal transfer in the case of a thermal PCB.

Utilization of the technologies that require 20um circuit geometries, 30um dielectric layers, 50um laser vias and 125um bump pitch processing.