Microwave Amplifiers High Frequency HF PCB Boards With High Power and Low Noise Band XCEM manufacturer from China Shenzhen Xinchenger Electronic Co.,Ltd

Microwave Amplifiers High Frequency HF PCB Boards With High Power and Low Noise Band

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: XCEM

Microwave Amplifiers High Frequency PCB Boards With High Power Low Noise Band

Spec

Microwave Amplifiers High Frequency PCB Boards With High Power Low Noise Band

Specification:

Wideband 18 to 40 GHz Amplifier High Frequency PCB

Board size: 15*6 cm

Material: Rogers

Board thickness: 0.2mm

Copper foil: 1OZ

Layer: 2

Model: XCEH

Parameter:

Min board thickness			2 layer 0.2mm
			4 layer 0.4mm
			6 layer 0.6mm
			8 layer 0.8mm
			10 layer 1.0mm
Max panel size			508*610mm
Board thickness toleranceT≥0.8mm±8%,T0.8mm±5%
Wall hole copper thickness			0.025mm(1mil)
Finished hole			0.2mm-6.3mm
Min line width			4mil/4mil(0.1/0.1mm)
Min bonding pad space			0.1mm(4mil)
PTH aperture tolerance			±0.075mm(3mil)

Description:

High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.

NPTH aperture tolerance			±0.05mm(2mil)
Hole site deviation			±0.05mm(2mil)
Profile tolerance			±0.10mm(4mil)
Board bend&warp			≤0.7%
Insulation resistance			1012Ωnormal
Through-hole resistance			300Ωnormal