Advanced Microstrip Patch Antenna PCB Board With Taconic RF Base Material XCET manufacturer from China Shenzhen Xinchenger Electronic Co.,Ltd

Place of Origin:

Zhejiang, China (Mainland)

Product Detail

Model No.: XCET

Advanced Microstrip Patch Antenna PCB Board With Taconic RF Base Material

Introduc

Advanced Microstrip Patch Antenna PCB Board With Taconic RF Base Material

Introduction:

The increasing complexity of electronic components and switches continually requires faster

signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times

in electronic components, it has also become necessary for high frequency (HF) technology to

view conductor widths as an electronic component.

Depending on various parameters, HF signals are reflected on circuit board, meaning that the

impedance (dynamic resistance) varies with respect to the sending component. To prevent such

capacitive effects, all parameters must be exactly specified, and implemented with the highest level

of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace

geometry,the layer buildup, and the dielectric constant (er) of the materials used.

Technology Sheet

Mr. KICO

Tel: 86-755-26055813

Contact to this supplier

Shenzhen Xinchenger Electronic Co.,Ltd [China (Mainland)]

Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

Capabilities	Standard Production	Advanced Production
Layer Count / Technology	4 - 28 Layers	4 - 28 Layers
PCB Thickness Range	0.5 - 2.4 mm	0.32 - 2.4 mm
Build Up	Core & Hybrid Build Up	Core & Hybrid Build Up
Materials	FR4 / Rogers / Taconic / others (Teflon based)	FR4 / Taconic / Rogers / others on request
Glass Transition Temperature	105 / 140/ 170	105/ 140/ 170
Standard Glass Cloth	106 / 1080 / 2116 / 1501 / 7628	1037 / 106 / 1080 / 2116 / 1501 / 7628
Copper Thickness	18μm / 35μm / 70μm	9μm / 18μm / 35μm / 70μm
Copper Plating Holes	20μm (25μm)	13μm / 20μm/ 25μm
Min. Line / Spacing	100μm / 100μm	50μm / 50μm
Soldermask Registration	‘+/- 65μm(Photoimageable)	’+/- 25μm (Photoimageable)
Min. Soldermask Dam	75μm	60μm
Soldermask Color	Green / white / black / red / blue	Green / white / black / red / blue
Max. PCB Size	575 mm x 500 mm	575 mm x 500 mm
Production Panel	609.6 mm x 530 mm	609.6 mm x 530 mm