Material

FR4(standard)

Isola 

FR4(Hi-Tg)

Isola / Nanya / ITEQ

Rogers

RO4003 /4350 /3010 /RT Duroid 5880 / 5870

Arlon

Diclad 25N / 25FR / 870 / 880

Taconic

TLY / TLC / RF35 / RF30

GETEK

RG200D / ML200D

Aluminum PCBs

Di-electric materials : FR4 / Bergquist / Rogers / Thermagon

Copper weight

1 ~ 5 oz  internal & external layers

Drilling

Min. Drilled Hole Size

10 mil ( 6 ~ 8 mil finished)

Annular Ring

5 mil(normal)    /    4 mil (for Laser vias)

Registration

± 3 mil

Max. Aspect Ratio

10 :1

Hole Size Tolerance

+/- 3 mils (PTH)  ;  +/- 2 mils (N-PTH)

Hole Roughness

< 0.8 mil

Min. Cu Plating in Holes

> 0.8mil,  Ave. 1 mil

 Laser drill

 available

Image Transfer

Min. Trace and space

4 / 4 mil

SMT / BGA.Pitch

10 mils for SMT   /    30 mils for BGA

Trace/space Tolerance

± 20%  (or +/- 10% per IPC class 3)

Solder Mask

LPI Solder Mask

Green(glossy or matte), Blue, Red, Black, Yellow

Via Plugging

min. 80% filled

Solder Mask ink

Taiyo & Tamura

Registration

± 2 mil

Min Solder Dam

2.5 mil

Thickness

0.5 ~1.5 mil

Silkscreen

White, Yellow, Black

Min. silkscreen width

8 mil

CNC Dimension

± 5 mil

Punch Dimension

± 4 mil

Blind Vias / Buried Vias

Yes

VIP (Via in Pad)

Yes (Non-conductive epoxy resin-filled or Cu filled)

Impedance control

± 10%

Surface Finish

HASL

200 ~ 500 μ"

Pb free HASL

100 ~ 500 μ"

Immersion Gold

1 ~ 5 μ"

Immersion Silver

6 ~ 12 μ"

Immersion Tin

25 ~ 40 μ"

Electolytic Gold

Yes

Gold Finger Plating

5 ~ 40 μ"

OSP(Entek)

yes

Solder Mask Coating Method

Silkscreen printing (Double or triple coatings available)

Carbon Ink

20 Ω

Peelable mask

Thickness = 0.3 mm

Pumice Pre-treatment

Available