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Shenzhen Xinchenger Electronic Co.,Ltd
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Gold Index: 8393
Immersion Silver F4B Single Sided PCB Board High Frequency HF PCB Boards
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
Immersion Silver F4B Single Sided PCB High Frequency HF Boards
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Immersion Silver F4B Single Sided PCB High Frequency HF Boards
| Model | Parameter | thickness(mm) | Permittivity(ER) |
| F4B | F4B | 0.38 | 2.2 |
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 |
Description
- Aluminum Composites: American Standard Circuits makes PCBs with unique aluminum composite materials to match the coefficient of thermal expansion (CTE) for various heat generating devices. These materials can match the CTE of ceramics, transistor packages and PCBs. This gives greater flexibility in designs to use lightweight materials and meet challenging environmental requirements.
- Pre-bonded and post-bonded materials
- Metals include Aluminum, Copper, Brass, Aluminum Composites
- Thermally and electrically conductive and non-conductive proprietary and commercially available adhesive bonded laminates
- Plated through hole capability metal carrier to PTFE
- Single, Double Sided & Multilayer PTFE PCB’s
- Precision pocket machining
- Heat Sink Technology
- Thin dielectric films
- Any type of wire bondable finishes
- In-house plating and precision machining for finished assemblies
Parameter:
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Layer |
1 to 28 layers |
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Material type |
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
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Board thickness |
0.21mm to 7.0mm |
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Copper thickness |
0.5 OZ to 7.0 OZ |
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Copper thickness in hole |
>25.0 um (>1mil) |
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Size |
Max. Board Size: 23 × 25 (580mm×900mm) |
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Min. Drilled Hole Size: 3mil (0.075mm) |
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Min. Line Width: 3mil (0.075mm) |
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Min. Line Spacing: 3mil (0.075mm) |
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Surface finishing |
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
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Tolerance
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Shape tolerance: ±0.13 |
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Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
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Certificate |
UL, ISO 9001, ISO 14001 |
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Special requirements |
Buried and blind vias+controlled impedance +BGA |
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Profiling |
Punching, Routing, V-CUT, Beveling |
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Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products. |
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Company Info
Shenzhen Xinchenger Electronic Co.,Ltd [China (Mainland)]
Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)
