Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards XCEM manufacturer from China Shenzhen Xinchenger Electronic Co.,Ltd

Place of Origin:

Zhejiang, China (Mainland)

Product Detail

Model No.: XCEM

Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards

Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards

Specification:

Parameter:

Wall hole copper thickness			0.025mm(1mil)
Finished hole			0.2mm-6.3mm
Min line width			4mil/4mil(0.1/0.1mm)
Min bonding pad space			0.1mm(4mil)
PTH aperture tolerance			±0.075mm(3mil)
NPTH aperture tolerance			±0.05mm(2mil)
Hole site deviation			±0.05mm(2mil)
Profile tolerance			±0.10mm(4mil)
Board bend&warp			≤0.7%
Insulation resistance			1012Ωnormal
Through-hole resistance			300Ωnormal
Electric strength			1.3kv/mm
Current breakdown			10A
Peel strength			1.4N/mm
Soldmask regidity			6H
Thermal stress			28820Sec
Testing voltage			50-300v
Min buried blind via			0.2mm(8mil)
Outer cooper thickness			1oz-5oz
Inner cooper thickness			1/2 oz-4oz
Aspect ratio			8:1
SMT min green oil width			0.08mm
Min green oil open window			0.05mm
Insulation layer thickness			0.075mm-5mm
Aperture			0.2mm-0.6mm
Special technology			Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish			HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating