Satellite Communications PCB Printed Circuit Board Design For Satcom Industry XCEM manufacturer from China Shenzhen Xinchenger Electronic Co.,Ltd

Satellite Communications PCB Printed Circuit Board Design For Satcom Industry

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: XCEM

Satellite Communications High Frequency PCB Circuit Boards For Satcom Industry

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Satellite Communications High Frequency PCB Circuit Boards For Satcom Industry

Specification:

Board size: 23*12 cm

Board thickness: 0.2mm

Copper foil: 3OZ

Layer: 2

Model: XCEH

Parameter:

Rogers	RO5880	0.254 0.508 0.762	2.20 ± 0.02
	RO4350	0.254 0.508,0.8,1.524	3.5
	RO4003	0.508	3.38
TACONIC	TLF-35	0.8	3.5
	TLA-6	0.254,0.8,1,1.5,	2.65
	TLX-8	0.254,0.8,1,1.6	2.55
	RF-60A	0.64	6.15
	TLY-5	0.254,0.508,0.8	2.2
	TLC-32	0.8,1.5,3	3.2
	TLA-35	0.8	3.2

Description:

High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.

Min board thickness			2 layer 0.2mm
			4 layer 0.4mm
			6 layer 0.6mm
			8 layer 0.8mm
			10 layer 1.0mm
Max panel size			508*610mm
Board thickness toleranceT≥0.8mm±8%,T0.8mm±5%
Wall hole copper thickness			0.025mm(1mil)
Finished hole			0.2mm-6.3mm
Min line width			4mil/4mil(0.1/0.1mm)
Min bonding pad space			0.1mm(4mil)
PTH aperture tolerance			±0.075mm(3mil)